Self-adjusting cryogenic Indium Interconnection
| German title: | Self-adjusting cryogenic Indium Interconnection | |
| Acronym: | SAIn | |
| Duration: | 1st August 2024 - 31st January 2027 | |
| Description: | An electrodeposited joining system based on indium bumps for flip-chip assembly is to be developed. The system enables a high electrical integration density, can be bonded at a temperature below 200°C and has superconducting properties below 4K. Furthermore, the capillary forces acting during the remelting of the bump are to be used to achieve self-alignment of the dies with an accuracy of ±1µm. | |
| Funded by: | Federal Ministry of Economic Affairs and Climate Action |  |
| Project sponsor: | Euronorm | |
| Funding code: | 49VF240014 | |
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