Packaging technology for thermal flow sensors
| German title: | Packaging Technologie für thermische Fluss-Sensoren | |
| Acronym: | Pack-Flu | |
| Duration: | 1st April 2024 - 31st March 2026 | |
| Description: | The project deals with the design, realization and characterization of a robust and innovative packaging platform for low-cost microcalorimetric flow sensors based on MEMS for use in gas pipelines or ventilation systems. The platform serves as a scalable basis for flow sensors to analyze and control air flow, hydrogen and other non-aggressive gases with known flow direction (e.g. in pipelines) with high accuracy. | |
| Funded by: | Federal Ministry of Economic Affairs and Climate Action |  |
| Project sponsor: | Euronorm | |
| Funding code: | 49MF230039 | |
News articles about Pack-Flu: | ||
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Packaging technology for thermal flow sensors 12. April 2024 |
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