Development of Temperature Compensated Silicon Strain Gauge Sensors
| German title: | Entwicklung von Temperaturkompensierten Silizium-Dehnmesssenoren | |
| Acronym: | TKompDMS | |
| Duration: | 1st November 2020 - 31st March 2022 | |
| Description: | The aim is to reduce the temperature dependence and improve the linearity of piezoresistive measuring bridges by investigating temperature diode-compensated strain gages. For this purpose, the dependence of the temperature diode signal on mechanical stresses is to be investigated and new test structures for determining mechanical properties of layers in the CMOS process are to be developed. | |
| Funded by: | BMWI |  |
| Project sponsor: | Euronorm | |
| Funding code: | 49MF200080 | |
News articles about TKompDMS: | ||
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Monitoring of safety-relevant flange gaskets 21. March 2023 |
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