Optimized reactive bonding technology based on novel zirconium systems for use in microsystems technology
| German title: | Optimierte reaktive Bondtechnologie auf der Basis neuartiger Zirkonium-Systeme für den Einsatz in der Mikrosystemtechnik | |
| Acronym: | JoinZiSi | |
| Duration: | 1st September 2020 - 28th February 2023 | |
| Description: | Exploring novel zirconium-silicon systems to help solve packaging and reliability issues in microsystems integration. The realization of smart electronic components and systems requires the addition of additional non-Moore's law scalable functions to logic and memory for functions such as sensing, actuation, communication, data protection, and power management. These heterogeneous functionalities can be monolithically integrated into a single system-on-chip (SoC), for example for embedded memory, or realized as discrete components through heterogeneous system-in-package (SiP) integration. To meet the demanding specifications and constraints of key applications, more functionality must be integrated in a smaller volume. This requires new assembly and packaging materials, compatible chip-package interfaces as well as heterogeneous integration of chips with different functionalities such as MEMS or sensors, power chips, processors or memory. Since applications must be designed to be as robust and reliable as possible, there is a focus on electrical capabilities and temperature constraints. | |
| Funded by: | BMWI |  |
| Project sponsor: | AIF | |
| Funding code: | 03167/20 | |
News articles about JoinZiSi: | ||
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Efficient joining process for microsystems technology 23. February 2023 |
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