CMOS-compatible thermopile infrared sensor arrays
| German title: | CMOS-kompatible Thermopile-Infrarotsensor-Arrays | |
| Acronym: | TPA | |
| Duration: | 1st September 2019 - 28th February 2022 | |
| Description: | A new thermopile infrared sensor array (TPA) is developed using a MEMS technology of filter arrays and thermopile sensor arrays (TPS arrays), with the filter arrays integrated on a cap wafer and the TPS arrays processed on a sensor wafer. This makes the new thermopile infrared sensor arrays robust, compact, suitable for large-scale production and cost-effective. | |
| Funded by: | BMWI |  |
| Project sponsor: | Euronorm | |
| Funding code: | 49MF190037 | |
News articles about TPA: | ||
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Influence of thin polysilicon layers on the performance of thermopiles 10. July 2023 |
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Mid-Week Coffee Break – A Virtual Technology Conversation 12. May 2021 |
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Thermopiles for non-contact temperature measurement at humans 26. March 2020 |
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