High Performance Wafer-Level Packaging for Industrial Sensors
| German title: | High Performance Wafer-Level Packaging für Industriesensorik | |
| Acronym: | HPPI | |
| Duration: | 1st October 2019 - 31st March 2022 | |
| Description: | The aim of the project is hermetic wafer-level packaging (WLP) for demanding sensor setups. An IR sensor with a temperature regime limited to 150°C during WLP will be realized, as well as an absolute pressure sensor with hidden measurement structures for use in aggressive media. For this purpose a CMP process will be established to achieve the surface quality for low temperature bonding processes & hermetic packaging. | |
| Funded by: | BMWI |  |
| Project sponsor: | Euronorm | |
| Funding code: | 49MF190071 | |
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