Thermal decoupling for high temperature sensor technology
| German title: | Thermische Entkopplung für Hochtemperatursensorik | |
| Acronym: | ThEK | |
| Duration: | 1st November 2019 - 30th April 2022 | |
| Description: | The aim of the project is to develop a scalable technology platform for the realization of high-temperature membranes (both closed and interrupted) for the realization of new innovative thermal sensor solutions and to reproducibly integrate them into the typical sensor process chains (wafer processing, assembly). The application should be possible at temperatures up to 350 °C. | |
| Funded by: | BMWI |  |
| Project sponsor: | Euronorm | |
| Funding code: | 49MF190090 | |
« back to project overview
