Flip chip assembly for building pressure sensors
| German title: | Flip-Chip-Montage zum Aufbau von Drucksensoren | |
| Acronym: | Flip-Chip-DDS | |
| Duration: | 1st August 2018 - 31st January 2021 | |
| Description: | In the project, a flip-chip assembly technology was developed for long-term stable assembly and connection technology for silicon-based pressure sensors with electrical vias. The new miniaturized media-resistant differential pressure sensor consists of two identical absolute pressure sensors. This solution has the advantage that a very small and compact assembly form can be realized. The developed assembly technologies with media-resistant and hermetically sealed potting are optimized with regard to long-term stability and media resistance. The overall assembly is calibrated and contains two ASICs for evaluation of the Wheatstone measurement bridge. Both an analog and a digital signal (I2C) are output. | |
| Funded by: | BMWI |  |
| Project sponsor: | EuroNorm GmbH | |
| Funding code: | 49MF180034 | |
News articles about Flip-Chip-DDS: | ||
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Differential pressure sensors for use in aggressive media 26. October 2020 |
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CiS at the MikroSystemTechnik Kongress in Berlin from 28-30 October 2019 12. July 2019 |
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