Development of a bonding process for innovative reactive systems with a focus on a laser-based ignition technology, industrial reliability and process safety.
| German title: | Entwicklung eines Bondverfahrens für innovative Reaktivsysteme mit dem Schwerpunkt einer laserbasierten Zündtechnologie, industrieller Zuverlässigkeit und Prozesssicherheit | |
| Acronym: | RNFSys | |
| Duration: | 1st December 2016 - 31st May 2019 | |
| Description: | The sub-project "Development of a bonding process for innovative reactive systems" was part of the joint project "Reactive low-temperature joining process for the low-stress assembly of high-precision sensor systems" (RNFSys) for the development of a reactive low-temperature joining process for the low-stress assembly of high-precision MEMS pressure sensors. The focus was on the development of a production-ready ignition technology for the reactive activation (ignition) of the reactive layer systems developed in the joint project. For this purpose, a system was designed and manufactured at the CiS Research Institute with which it is possible to ignite RMS systems under defined technological parameters in a pulse-controlled manner using a high-energy laser. The project was funded by the BMBF program KMU-Innovativ. |
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| Funded by: | BMBF |  |
| Project sponsor: | VDI/VDE | |
| Funding code: | KMU15/418 | |
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