Feedback-free direct assembly of MEMS sensors
| German title: | Rückwirkungsfreier Direktaufbau von MEMS-Sensoren | |
| Acronym: | RUDIS | |
| Duration: | 1st June 2016 - 31st August 2018 | |
| Description: | The aim was to realize a technology for a simple, cost-reduced direct assembly of MEMS sensors for alternative applications. For this purpose, special pressure sensors were installed on different carrier boards made of glass, ceramics, etc. and their properties were compared with standard setups. By compensating various influencing factors by means of material selection, special designs and suitable AVT processes, high-precision pressure sensors with excellent chemical and mechanical stability were produced, which were confirmed by extensive measurements. |
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| Funded by: | BMWI |  |
| Project sponsor: | EuroNorm GmbH | |
| Funding code: | MF150176 | |
News articles about RUDIS: | ||
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Barometric MEMS pressure sensor for bio- and medical technology 24. April 2017 |
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