Development of a CMOS-compatible thermopile infrared sensor for gas detection
| German title: | Entwicklung eines CMOS-kompatiblen Thermopile-Infrarotsensors für Gasdetektion | |
| Acronym: | TPS | |
| Duration: | 1st September 2015 - 31st October 2017 | |
| Description: | The project objective was to develop a new thermopile infrared sensor (TPS) based on a CMOS-compatible stack interconnection technology of filter, thermopile infrared sensor and carrier substrate. For the thermopile infrared sensors, the development included a polysilicon layer on a thin silicon membrane, a CMOS-compatible absorber, and a wafer-level hermetic package for cap, sensor, and support wafers. This was realized by vacuum silicon wafer direct bonding. As a result, the new thermopile infrared sensors are robust, compact, suitable for large-scale production and cost-effective. They can be used for gas detection. | |
| Funded by: | BMWI |  |
| Project sponsor: | EuroNorm GmbH | |
| Funding code: | MF150013 | |
News articles about TPS: | ||
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Influence of thin polysilicon layers on the performance of thermopiles 10. July 2023 |
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