Assembly and packaging technology of miniaturized, silicon-based strain measurement sensors
| German title: | Aufbau- und Verbindungstechnik von miniaturisierten, siliziumbasierten Dehnungsmesssensoren | |
| Acronym: | SiStGAP | |
| Duration: | 1st February 2016 - 31st December 2017 | |
| Description: | CiS has many years of experience in manufacturing piezoresistive highly stable pressure sensors. This technological know-how formed the basis for the development of miniaturized, silicon-based strain gauge sensors (Si strain gages) with significantly smaller space requirements than conventional metal foil strain gages. Both chip production and assembly and connection technology for a wide range of materials, from separation to electrical contacting, have been optimized and open up new innovative applications. | |
| Funded by: | BMWI |  |
| Project sponsor: | EuroNorm GmbH | |
| Funding code: | MF150091 | |
News articles about SiStGAP: | ||
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Premiere at the iENA Nuremberg: Focus on innovative sensor technology 24. October 2024 |
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Monitoring of safety-relevant flange gaskets 21. March 2023 |
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Trade Fair Sensor+Test and Congress SMSI 30. April 2021 |
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CiS at the MikroSystemTechnik Kongress in Berlin from 28-30 October 2019 12. July 2019 |
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Reliable Measurement of Pressure, Force or Strain – Piezoresistive Sensor Elements in Medical Technology 9. November 2017 |
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Bolt 4.0 presented at Hannovermesse 3. May 2017 |
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Better safe than sorry – measurement of pretensioning forces in bolted joints 16. April 2017 |
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Silicon strain gauge 7. October 2016 |
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Strain gauges for demanding applications 17. March 2016 |
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