Microchannel cooling
| German title: | Mikrokanalkühlung | |
| Acronym: | Mikrokanalkühlung | |
| Duration: | 1st July 2014 - 31st December 2016 | |
| Description: | The goal of the development was a miniaturized microchannel cooler for dissipating the power loss of CMOS Monolithic Active Pixel Sensors. The cooling can significantly increase the sampling rate at the same operating temperature and the signal quality. Due to the use for radiation detectors a low material budget is necessary. The maximum thickness is therefore only 200 µm. In addition, rewiring carriers were integrated on the mounting surface for the circuit to be cooled. | |
| Funded by: | BMWI |  |
| Project sponsor: | EuroNorm GmbH | |
| Funding code: | MF140032 | |
| Contact: | Contact us about this project via our business unit MEMS | |
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