New solderable metallization processes in the submicrometer range for pixel detectors
| German title: | Neue lötbare Metallisierungsverfahren im Submikrometerbereich für Pixeldetektoren | |
| Acronym: | µPixSol | |
| Duration: | 1st July 2014 - 31st December 2016 | |
| Description: | Inexpensive metallization and soldering processes for extremely small contacts on radiation detectors were investigated and evaluated for their applicability in the single-digit micrometer range. On the one hand, the aim was to enable the wafer-side requirements for reproducible soldering for an established soldering technique, namely solder ball placement. On the other hand, the technological feasibility of different soldering processes such as screen printing, light electroplating, dip soldering and solder transfer was investigated, which show a high degree of cost efficiency for the in-house pixel detectors. The quality of the soldering was evaluated using flip-chip structures. With innovative structural layers on radiation detectors, extremely small solder balls of 30 µm and 40 µm could be placed with location accuracy. Together with the Technical University of Ilmenau, the adaptation of a metallization process established in the solar field to radiation detectors, namely light-induced electroplating, which does not require expensive lithogaphy processes, was successful. Particularly small tin solder balls of about 10 µm diameter on a nickel metallization were applied very homogeneously to wafers. Module assemblies were used to demonstrate suitability for radiation detector modules. |
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| Funded by: | BMWI |  |
| Project sponsor: | EuroNorm GmbH | |
| Funding code: | MF130134 | |
| Contact: | Contact us about this project via our former business unit Silicon Detectors | |
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