From November 12 to 15, 2024, the European semiconductor industry will meet at SEMICON Europe in Munich. This largest European semiconductor trade fair takes place parallel to electronica and will be held in 2024 under the motto “Innovation and Collaboration: Powering Sustainable Exponential Growth”.
The CiS Research Institute will be exhibiting at this trade fair in Munich for the first time. Interested visitors will find our stand at the joint Thuringian LEG stand C1718 in Hall C1.
As a sensor specialist, we research, develop and manufacture silicon-based sensors and sensor modules for pressure, force and strain measurement as well as for the detection of light and radiation in various energy ranges. Our sensors are primarily used in industrial process measurement technology, basic research, medical technology and the life sciences. At SEMICON Europe, we will be presenting a selection of our research and development results:
High-end acceleration sensors (HEB)
These new very high-resolution capacitive MEMS acceleration sensors have a resolution of 0.001⁰ and are based on the use of chip-level process steps.
They are suitable for inclination and leveling measurements as well as condition monitoring.
» Infosheet: High-end acceleration sensors (HEB)
Galvanically isolated incremental sensor (GalGIS)
The galvanic incremental sensor can be used in optical encoders for position and speed sensors – especially where high technical safety is required – for example in aerospace, rail transportation and medical technology.
» Infosheet: Galvanically isolated incremental sensor (GalGIS)
Improving the stability of hybrid silicon strain sensors (SiDMeses)
By minimizing the mounting stresses and achieving high overload resistance, the hybrid silicon strain sensors have improved stability. These sensors enable very precise measurements in a wide range of applications from automation technology to the hydrogen industry.
» Infosheet: Hybrid silicon strain sensors (SiDMeses)
Further exhibits will be presented at the trade fair stand.
» Infosheet: Fast infrared emitter array (FIRE)
» Infosheet: Highly sensitive low-noise blue-violet avalanche photodiodes (BVAPD)
» Infosheet: Retrofit kit for non-invasive pressure measurement (NivLer)
We look forward to your visit and a stimulating exchange of ideas.
The research and development work described in the following research projects was funded by the Federal Ministry for Economic Affairs and Climate Action (BMWK):
Galvanically isolated incremental sensor (GalGIS)
Funding code: 49VF123456
Fast infrared emitter array (FIRE)
Funding code: 49MF220020
Highly sensitive low-noise blue-violet avalanche photodiodes (BVAPD)
Funding code: 49MF200098
High-end acceleration sensors (HEB)
Funding code: 49VF200064
Improving the stability of hybrid silicon strain sensors (SiDMeses)
Funding code: 49MF200061
Retrofit kit for non-invasive pressure measurement (NivLer)
Funding code: 49MF220174
