We invite you to get to know our CiS Forschungsinstitut für Mikrosensorik GmbH at the world-renowned forum for sensor, measuring and testing technology in Nuremberg from 11th-13th June 2024. We will be presenting a selection of research and development results at booth 501 in hall 1.
This year’s trade fair highlights include the development of a high-end acceleration sensor and special tandem diodes.
High-end acceleration sensors (HEB)
As part of the “HEB” research project, new very high-resolution capacitive MEMS acceleration sensors with a resolution of 0.001⁰ were developed at the CiS Research Institute. They are suitable for inclination and leveling measurements as well as condition monitoring.
The basis was formed by concepts from the high-end application area with a focus on the use of chip-level process steps.
The HEB individual sensors were initially joined at chip level. The opposing chips are pressed together using a fine placer so that the metal structures of the spring-mass or carrier chips (Si or glass) are connected using Au-Stud bumps and the distances are set to approx. 5.6 µm.
The sensors are characterized by an increased seismic mass, a laterally arranged differential capacitor and a hermetic package. Demonstrator setups show good agreement with the simulated results. Details and properties include the
» Infosheet: High-end acceleration sensors (HEB)
» Project description
Tandem diodes for standing wave interferometers (SWIF)
Optical methods allow a particularly precise distance measurement in which the wavelength of the light itself is used as the basic distance scale. One elegant way of measuring distance is, for example, via the position-dependent intensity of a standing wave (standing wave interferometer).
The CiS Research Institute has developed tandem diodes that significantly simplify the design of the well-known Michelson interferometer, a high-precision measurement method for determining the length and position of precision machines.
Scientists at the CiS Research Institute have succeeded in developing transparent detectors for this purpose, whose active layers are made of doped silicon or polysilicon. These transparent photodiodes absorb only a very small part of the incident light in extremely thin silicon layers. The unabsorbed part of the light passes through the detector and can be used for sensory applications.
In a double configuration (tandem), two such partially transparent diodes are stacked in a multi-layer chip with a high degree of spacing accuracy. This makes it possible to realize standing-wave interferometers with direct resolution of the direction of movement. The usual division into reference and sample beams via beam splitters becomes superfluous and the system can be realized much more simply and compactly.
In addition to these research highlights, the CiS Research Institute will also be showcasing a selection of other MEMS and MOEMS developments. These include:
» Infosheet: Galvanically isolated incremental sensor (GalGIS)
» Infosheet: Fast infrared emitter array (FIRE)
» Infosheet: Highly sensitive low-noise blue-violet avalanche photodiodes (BVAPD)
» Infosheet: Hybrid silicon strain sensors (SiDMeses)
» Infosheet: Retrofit kit for non-invasive pressure measurement (NivLer)
The research and development work described in the following research projects was funded by the Federal Ministry of Economic Affairs and Climate Action(BMWK):
Galvanisch getrennter Inkrementalsensor (GalGIS)
Funding code: 49VF123456
Flinkes Infrarot-Emitter-Array (FIRE)
Funding code: 49MF220020
Hochempfindliche rauscharme Blauviolett-Avalanche-Photodioden (BVAPD)
Funding code: 49MF200098
Tandemdiode
Funding code: 49VF200011
High-End-Beschleunigungssensoren (HEB)
Funding code: 49VF200064
Verbesserung der Stabilität hybrid aufgebauter Silizium-Dehnungssensoren (SiDMeses)
Funding code: 49MF200061
Nachrüstsatz zur nichtinvasiven Druckmessung (NivLer)
Funding code: 49MF220174
The 22nd GMA/ITG Symposium Sensors and Measuring Systems 2024 will take place in Nuremberg on June 11/12, 2024 at the same time as the Sensor and Test trade fair. The CiS Forschungsinstitut will be represented with 2 presentations at this top-class congress. On 11th June 2024, Mario Bähr will present a “Pressure sensor concept based on NV centers in diamond” at 2:30 PMin block A2 (Innovative sensor technology for mechanical measured variables). The functionality of a sensor concept manufactured using standard industrial methods will be demonstrated, which reads out local stresses in a ceramic transmitter. The concept offers the opportunity for calibration-free and high-temperature stable pressure sensors. The developments are being developed as part of the BMBF-funded project “QSENS-QInd” with the partner Endress&Hauser. The lecture will take place in Room London, NCC West.
Toni Schildhauer will talk about fast MEMS IR emitters for NDIR applications. For spectroscopy applications in the mid-infrared range, there are currently no broadband thermal sources that can generate measurement frequencies of over 20 Hz without an external chopper. In the BMWK-funded FIRE project, IR MEMS emitters are being developed that can pulse independently at over 100 Hz, thus enabling the miniaturization and cost reduction of sophisticated analyzers. The presentation will take place as part of Session B3 – IRS² – Infrared Sensors Part I, on Wednesday, June 12, 2024, 11:40 AM in Room Amsterdam, NCC West.
