Non-contact, interferometric distance measurement
Technologies from microsystems engineering and microoptics form the basis for the successful miniaturization of a new, interferometric distance measurement system from TETRA GmbH in Ilmenau. The core component, consisting of a Michelsen laser interferometer and an optical silicon detector, was developed by the mechatronics specialist together with the Microoptical Systems Application Center at CiS Research Institute
Interferometric pressure sensor
Using MEMS wafer technologies and a silicon photodiode array with embedded laser light source (naked VCSEL), the CiS Research Institute has succeeded in integrating the complete optical sensing of the pressure-sensitive, membrane (Silizum) in a very flat package space – comparable to capacitive or piezoresistive sensors
3D silicon photodiode with PigTail
The 3D structuring of silicon is becoming increasingly important for optical and opto-electronic applications in microsystems technology. For the reliable and low-loss coupling of optical fibers to photodiodes, the CiS Research Institute developed new microstructuring technologies for the fabrication of cavities with flank angles of 45° and 90° and high optical absorption of the sensitive coupling surface
Power from light – fieldbus-compatible sensors for extreme operating conditions
For the use of sensor systems under extreme conditions, such as in EMC-critical or Ex-protected areas, a galvanic connection of the sensors for energy supply or signal transmission is often not possible. Together with industrial partners, the application center microoptical systems of the CiS research institute developed a solution compatible with existing fieldbus systems
ToMess multi-sensor module
Microstructured reactors have been successfully finding their way into the laboratories and production facilities of large-scale and fine chemistry as well as medicine for several years. Worldwide research activities impressively show that the use of the micro-process engineering components can achieve a multitude of reaction engineering advantages in chemical processes
Low temperature silicon direct bonding
Low-temperature silicon direct bonding has gained significantly in importance in recent years. In addition to the possibilities of vertical integration, it opens up new process technology opportunities through the application of wafer-level packaging as a post-process in sensor manufacturing
Impedance sensor technology at the CiS Research Institute
CiS has many years of expertise in the field of impedance sensor technology. In addition to the classic field of humidity measurement, new fields of application are being developed
Optoelectronic sensor ensures reliable refrigeration technology
Based on special chip and assembly technologies from the CiS Research Institute, the ILK Institut für Luft- und Kältetechnik gGmbH, Dresden has developed a cost-effective multi-parameter system for continuous monitoring of humidity, bubble formation, temperature and level in refrigerant systems
Jena scientist Astrid Bingel receives honor for outstanding diploma thesis
For the third time, CiS e.V. awarded a prize for diploma or master theses in the fields of sensors, actuators, microsystems technology and photovoltaics. This prize recognizes outstanding work in these fields, preferably done in conjunction with industry
CiS Research Institute becomes affiliated institute of TU Ilmenau
On August 11, 2011, the ceremonial signing of a contract for the recognition of the CiS Research Institute as an affiliated institute of the TU Ilmenau took place during the kick-off event for the Solar Research Initiative at the TU Ilmenau
