Highly stable temperature diodes with single-point calibration for the temperature range up to 220°C
/in Silicon Detectors, WaferprocessingAt the CiS Research Institute, technological processes for silicon wafers were developed with which a reproducible sensitivity dU/dT, i.e. the slope of the voltage versus temperature, could be achieved
New sensor technologies for pulse contour analysis, determination of heart rate variability and measurement of blood flow in tissue
/in Medical technology, MOEMS, PackagingCiS Research Institute introduces miniaturized silicon integrated multispectral photoplethysmography sensors. These are placed in the external auditory canal and are individually adapted to the patient
Assembly & Packaging – compact, application-specific and industry-relevant
/in MOEMS, Packaging, UVA new micro assembly center expands the technological basis for new concepts for the fully automated production of application-specific UV LED modules in different series sizes. The modular system concept enables the most important AVT assembly steps to be carried out in one device
Wafer technologies for micro laser illuminations
/in MOEMS, WaferprocessingThe CiS Research Institute has developed a cost-effective technology for the production of highly stable laser illuminators in a batch process. In this process, up to 20,000 of these modules are mounted on a glass wafer. The VCSEL-based laser modules are characterized by high beam quality
Strain gauges for demanding applications
/in Force, MEMS, PackagingFor precision force measurements, the CiS Research Institute from Erfurt has developed miniaturized silicon strain gages (Si strain gages) with integrated measuring bridge. By using semiconductor technologies, a higher long-term stability, precision and measurement reliability is achieved compared to ductile metal strain gages
Semiconductor Complex Measuring Station
/in Measurement, PressureManufacturing technology and sensors are tested and characterized with a high level of metrological effort in order to be able to demonstrate the desired properties with long-term stability. Different measurement methods are required for this purpose. The new semiconductor complex measuring station represents a milestone in the characterization of technologies and sensors
“STREAM” – New EU project launched at CiS
/in Events, Jobs, Silicon DetectorsOn 18 January 2016, the launch event for a new research project with 11 European partners from Switzerland, Germany, the Netherlands, Great Britain, Austria, Italy, Norway and France took place at CERN. STREAM stands for “Smart Sensor Technologies and Training for Radiation Enhanced Applications and Measurements” and is funded by the EU with 3.9 million euros
Assembly & Packaging – compact, application-specific and industry relevant
/in MOEMS, Packaging, UVA new micro assembly centre expands the technological basis for the development of technological solutions for the fully automated production of application-specific UV LED modules in different series sizes. The modular system concept enables the most important packaging steps to be carried out in one unit
Semiconductor Complex Measuring Station
/in Measurement, PressureManufacturing technology and sensors are tested and characterized with a high level of metrological effort in order to be able to demonstrate the desired properties with long-term stability. Different measurement methods are required for this purpose. The new semiconductor complex measuring station represents a milestone in the characterization of technologies and sensors
Wafer technologies for micro laser illuminations
/in MOEMS, WaferprocessingThe CiS Research Institute has developed a cost-effective technology for the production of highly stable laser illuminators in a batch process. In this process, up to 20,000 of these modules are mounted on a glass wafer. The VCSEL-based laser modules are characterized by high beam quality