
Workshop „Future Technologies for Radiation Detectors”
/in Analytics, Events, Packaging, Silicon DetectorsFor the 3rd time, the international workshop “Future of Silicon Detector Technologies” focused on technologies and devices for the development and production of radiation detectors. The focus was also on future research priorities in order to be able to manufacture sensors with extremely high radiation hardness with long-term stability and at low cost. In particular, the new experiments at CERN and at the Gesellschaft für Schwerionenforschung (Society for Heavy Ion Research) in Darmstadt require this radiation hardness in addition to other technical parameters
06.02.2018: CiS at SPIE Photonics West 2018
/in Events, MOEMS, Packaging, Photonic, WaferprocessingFor the first time, CiS Forschungsinstitut für Mikrosensorik GmbH was represented as an exhibitor at SPIE Photonics West 2018 in San Francisco. As one of 70 German exhibitors in the German Pavilion in the North Hall of the Moscone Center, the CiS Research Institute demonstrated its expertise in the design as well as the manufacture and assembly of customised optical microsensors
Foundation of the German-Chinese MEMS Smart Sensor Institute
/in Events, MEMSOn 28 November 2017, the “German-Chinese MEMS Smart Sensor Institute” was founded in Jiangsu, China. The aim is the joint development and industrialisation of novel MEMS sensors and systems. The CiS Research Institute in Erfurt serves as a role model. The independent research institute, which is close to the economy, was selected because it has been developing MEMS for over 20 years and has been very successful in transferring them to industrial production
Reliable Measurement of Pressure, Force or Strain – Piezoresistive Sensor Elements in Medical Technology
/in Force, Measurement, Medical technology, MEMS, Packaging, PressurePiezoresistive pressure sensor chips from CiS are used where high precision, stability and reliability are required. The same sensor principle is now also used for force measurement in silicon strain gages. The strain-sensitive resistors are monolithically integrated into wafer-thin chips as Wheatstone measuring bridge
CiS Forschungsinstitut organises Diamond Summer School, 24.-28.9.2017, Elgersburg
/in Events, QuantumThe CiS Research Institute organised a summer school at the “Hotel am Wald” in Elgersburg from 24 to 28 September 2017. Renowned experts in diamond research imparted expertise on synthetic diamond coatings to students, PhD students, researchers and scientists in a total of 11 lectures
Antje Tillmann visits CiS Forschungsinstitut für Mikrosensorik GmbH
/in PoliticsOn 13 September 2017, Antje Tillmann (CDU), Member of the Bundestag, visited the CiS Research Institute for Microsensors to find out about current developments and challenges for the further positioning of Erfurt as a microelectronics location in global competition
Erfurt microsensor technology for mobile diagnostics – CiS strengthens cooperation with InfectoGnostics
/in Medical technology, PhotonicCiS Research Institute will in future provide even more intensive support for the development of diagnostic point-of-care systems at the InfectoGnostics research campus in Jena. Having already contributed its expertise to campus projects as an associated partner, CiS is now officially joining the public-private partnership of InfectoGnostics
Carsten Schneider visits CiS Forschungsinstitut für Mikrosensorik GmbH
/in PoliticsMember of the Bundestag Carsten Schneider (SPD) met with industry representatives and scientists for joint talks at the CiS Research Institute for Microsensors on 20 July 2017
Contactless measurement of blood flow
/in Medical technology, MOEMSThe micro laser Doppler sensor (MiLD) aims to measure the velocity of light-scattering objects and can be used for in vivo assessment of the flow velocity of blood in the skin. Numerous disease symptoms and healing processes can be monitored
New sensor technologies for tracking blood pressure changes
/in Medical technology, MOEMS, Simulation & DesignThe CiS Research Institute has been developing miniaturised, silicon-integrated, multispectral photoplethysmography sensors for well over a decade. The tiny sensors are placed in the external auditory canal and are individually adapted to the patient