In the LaWaDos research project, a development team from the CiS Research Institute is optimizing the contacting of piezoresistive sensors using wire bond contacts. The aim is to produce reliable contacts with long-term stability that can withstand process temperatures above 500 °C. Stable contacts at the interface between metal and semiconductor are crucial for the performance and reliability of semiconductor components. Instead of the established metallization, a high-temperature stable contact system is being developed, preferably with a barrier layer of tungsten or tantalum. The reproducible production of contacts is a major challenge for complex-shaped sensor components. The investigation and optimization of these processes are a prerequisite for subsequent standardized series production.
The results of this research project support the efforts of designers and plant operators to place sensors as close as possible to the area under investigation in order to be able to monitor and control thermal processes more quickly and reliably.
The research and development work described was funded by the Federal Ministry of Economic Affairs and Climate Action (BMWK) as part of the “High-temperature optimized contact metallization” (LaWados) research project.
Funding code: 49MF230021
