As part of the Compamed in Düsseldorf, which starts today, the Thuringian research institute, which was founded in 1993, presents current research results. The development of silicon-based microsensor elements for applications in industry, medicine and the environment has been a core competence of the CiS Research Institute for many years. In hall 8a at booth H23.1 interested visitors can inform themselves about trends in silicon-based sensors until Thursday.
MEMS infrared emitters for gas analysis
Modern and accurate gas sensors are based on the NDIR measurement concept, which requires a broadband infrared light source to evaluate the gas-specific light absorption in the IR. MEMS solutions are much smaller and more shock resistant than conventional filaments, which simplifies optical and mechanical integration into the sensor system. On the other hand, these IR sources consume significantly less power and are significantly faster in their switch-on and switch-off behavior. This makes MEMS IR emitters the preferred choice for both mobile sensor solutions and stationary applications with high requirements, such as respiratory gas analysis, process measurement technology or environmental monitoring.
The CiS Research Institute develops and produces MEMS-IR emitters for various customer-specific applications. In addition to different component sizes and power classes, we offer innovative solutions for emitters with increased dynamics, improved emission characteristics and long service life.
Silicon LED packaging for more UV light
Modern, semiconductor-based UV LEDs create fields of innovation and promise markets with high economic benefits. They do not contain toxic mercury, which is still used today in conventional lamp technology. They are much smaller and more durable than conventional UV lamps and more resistant to vibration and shock, resulting in fewer breakdowns and reduced disposal and maintenance costs.
In medicine, powerful UV LEDs make the detection of pathogens or the targeted sterilisation and disinfection of surfaces and water more flexible, efficient, safe and reliable.
The CiS Forschungsinstitut develops and manufactures high-quality, hermetically sealed housings for LEDs. The component carrier is a silicon chip with electrical through-plating to the rear and an integrated protective diode for the sensitive UV LED. A reflector frame – also based on a silicon chip – surrounds the LED and ensures that the light emitted from the side is deflected forwards. A planar optic is used as a hermetic lid, which additionally bundles the UV light of the LED packaged in this way. The assembly of this SMD-capable multichip module takes place completely on the wafer level, which – despite the high-quality materials – results in low manufacturing costs. The high thermal conductivity of the base material silicon enables very good heat dissipation of the LED and thus guarantees a long service life. At the same time, the reflector and optical lens triple the usable light.
