The current project “JoinZiSi – Optimized reactive bonding technology based on novel zirconium systems for use in microsystems technology” is concerned with the development of an efficient joining process and is representative of the research work in the Process Development department at the CiS Research Institute
Resonant pressure sensors have versatile potential for applications in the hydrogen economy. The newly launched research project ReSi-DDS of the CiS Research Institute aims at the development of stacking technologies for the fabrication of resonator structures for resonant silicon pressure sensors
Start for the preliminary research project “High-End Acceleration Sensors”(HEB) – The project aims at the development of a CMOS-compatible manufacturing process for high-resolution capacitive MEMS acceleration sensors with a resolution of 0.001⁰ for cost-efficient application as tilt sensor
As part of the M-Gravi project, the CiS Research Institute is developing novel gravity sensors for high-precision exploration of the geological features of the Earth’s surface. The sensors consist of four individual silicon wafers and use a wafer-level stacking technology
Photoacoustic sensors measure carbon dioxide and nitrogen oxides with high sensitivity. Increasingly, other gases such as methane, ammonia, ethylene or gas leaks in pipelines are being detected. In the PAS project, the CiS Research Institute is starting the development of an integrated photoacoustic gas sensor based on NDIR sensors
The 1st status workshop of the BMBF growth core HIPS will take place on April 7, 2021 as a free online event. Organized by the host TU Ilmenau, guests and interested parties are welcome from 9:00 to 16:30. The CiS Research Institute is involved in two projects to develop an innovative multi-sensor platform for capturing sensor information in challenging environments
For the first time, CiS Forschungsinstitut für Mikrosensorik GmbH was represented as an exhibitor at SPIE Photonics West 2018 in San Francisco. As one of 70 German exhibitors in the German Pavilion in the North Hall of the Moscone Center, the CiS Research Institute demonstrated its expertise in the design as well as the manufacture and assembly of customised optical microsensors
The CiS Research Institute has developed large-area radiation detectors whose sensitive area is thinned down to the thickness of a normal sheet of paper. During processing, it was possible to dispense with the use of additional handling wafers, which is still common practice in industrial production today
At the CiS Research Institute, technological processes for silicon wafers were developed with which a reproducible sensitivity dU/dT, i.e. the slope of the voltage versus temperature, could be achieved
The CiS Research Institute has developed a cost-effective technology for the production of highly stable laser illuminators in a batch process. In this process, up to 20,000 of these modules are mounted on a glass wafer. The VCSEL-based laser modules are characterized by high beam quality
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E-Mail: info@cismst.de
