Projektstart SAIn: Selbstregulierende kryogene Indium-Verbindung
The new research project SAIn (Self-adjusting cryogenic Indium Interconnection) pursues the goal of a self-adjusting chip level package with an adjustment accuracy of ±1µm and better. It includes the development of the electroplating process for indium deposition to produce the indium contacts and the reflow process to remelt the deposited indium columns into indium bumps