The “Hivos” project follows the industry’s request and aims at higher automation by deposition and patterning of adhesive coatings at wafer level and the associated improved assembly accuracy. Innovative materials and processes are also intended to increase value creation at wafer/benefit level
With the started project “Piezo-junction effect based on-chip multi-sensors” the effects of environmental influences on differently designed pn-junctions or more complex bipolar lateral and vertical on-chip silicon structures will be investigated at the CiS Research Institute
The current project “JoinZiSi – Optimized reactive bonding technology based on novel zirconium systems for use in microsystems technology” is concerned with the development of an efficient joining process and is representative of the research work in the Process Development department at the CiS Research Institute
In the smartBond project, the assembly and force-fit and electrically conductive joining of photodiodes to hybrid detector modules was investigated and optimized by means of thermocompression bonding with chemically electrodeposited pillar structures and their highly accurate positioning by means of so-called self-alignment.
Together with the CiS Research Institute, CiS e.V. regularly presents the Silicon Science Award for outstanding scientific achievements in the field of microsystems technology. The sponsors provide a total of 4,000 euros in prize money, which this year was awarded to three winners
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