After a successful pitch at getstarted2gether, the founding project “Early Fault Detection in High-Performance Batteries” of DC Industrie Entwicklung GmbH is currently being further developed to production and process maturity. The CiS Research Institute supports the start-up during the funding period with its technical infrastructure as well as its competence in silicone from more than 25 years
The InnoCON is a platform that presents successful projects and invites networking. The CiS Research Institute presented technological challenges of the project “TeSIS – Textured Blackbody MEMS IR Emitter” and presented itself at the joint stand of the FTVT
The new research project “Pressure sensor made of <110> silicon with increased linearity” promises a significant reduction of calibration effort, potential sources of error and costs for high-precision pressure sensing elements
At Sensor+Test 2019, the CiS Research Institute will present current developments and research results from the MEMS, MOEMS and silicon detectors business units for applications in industry, medical and environmental technology
At HMI 2019, CiS will be presenting sophisticated packaging for time-of-flight camera modules, double-sided microstrip detectors and other current development results in a double pack at the Thuringia joint LEG stand in Hall 4, Stand F34 and at the stand of Forschungs- und Technologieverbund Thüringen e.V. (FTVT) in Hall 2, Booth A27
At Sensor+Test 2018 in Nuremberg, the CiS Research Institute will present a high-temperature pressure sensor system suitable for series production with an operating temperature of up to 300°C
Our exhibition at the Innovation Day of SMEs of the BMWi on June 7, 2018 in Berlin generated good feedback and high interest. Here, our research institute presented the INNO-KOM project “Wafer Level Packaged Pressure Sensor With Through Silicon Vias”
With the repeated participation as an exhibitor on the community stand of the Thuringian State Development Corporation, the CiS Research Institute could register consistently positive feedback in numerous discussions with interested parties from industry and medium-sized businesses
Piezoresistive pressure sensor chips from CiS are used where high precision, stability and reliability are required. The same sensor principle is now also used for force measurement in silicon strain gages. The strain-sensitive resistors are monolithically integrated into wafer-thin chips as Wheatstone measuring bridge
At Sensor+Test 2017, the CiS Research Institute for Microsensors presents highly stable, media-resistant barometric pressure sensors in MEMS technology
Konrad-Zuse-Str. 14
99099 Erfurt
Germany
Tel.: +49 361 663 1410
E-Mail: info@cismst.de
