Developers and manufacturers of sensor technology, medical technology and bioanalytics met for the 1st workshop in Erfurt on 10 May 2017 to present innovative solutions from microsystems technology in prevention, diagnosis, analytics and therapy and to network interdisciplinarily
At Sensor+Test 2017, the CiS Research Institute for Microsensors presents highly stable, media-resistant barometric pressure sensors in MEMS technology
A new micro-assembly centre expands the technological basis for the development of technological solutions for the fully automated assembly of application-specific UV LED modules in different series sizes and designs, whether as single LED sources or area lamps.
The modular system concept enables the most important AVT assembly steps to be carried out in one unit
The MEMS technologies available and further developed at the CiS Research Institute were the basis for the development of a new generation of spectral sensors consisting of two detector chips stacked on top of each other. Each covers a specific spectral range. The upper diode is only 50 µm thin
For precision force measurements, the CiS Research Institute has developed miniaturised silicon strain gauges (Si-DMS) with an integrated measuring bridge. The piezoresistive resistors are monolithically integrated in single-crystal silicon (K-factor = 80) and are available as a double strain element and as a full bridge
CiS Research Institute introduces miniaturized silicon integrated multispectral photoplethysmography sensors. These are placed in the external auditory canal and are individually adapted to the patient
A new micro assembly center expands the technological basis for new concepts for the fully automated production of application-specific UV LED modules in different series sizes. The modular system concept enables the most important AVT assembly steps to be carried out in one device
For precision force measurements, the CiS Research Institute from Erfurt has developed miniaturized silicon strain gages (Si strain gages) with integrated measuring bridge. By using semiconductor technologies, a higher long-term stability, precision and measurement reliability is achieved compared to ductile metal strain gages
A new micro assembly centre expands the technological basis for the development of technological solutions for the fully automated production of application-specific UV LED modules in different series sizes. The modular system concept enables the most important packaging steps to be carried out in one unit
CiS Research Institute introduces miniaturized silicon integrated multispectral photoplethysmography sensors. These are placed in the external auditory canal and are individually adapted to the patient
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99099 Erfurt
Germany
Tel.: +49 361 663 1410
E-Mail: info@cismst.de
