The InnoCON is a platform that presents successful projects and invites networking. The CiS Research Institute presented technological challenges of the project “TeSIS – Textured Blackbody MEMS IR Emitter” and presented itself at the joint stand of the FTVT
As base metallization, copper offers a wide range of metallization possibilities which are necessary for process optimization of the thermocompression process
From 28 to 30 October 2019, employees of the CiS Research Institute will present the latest development results on optical microsystems, packaging and measuring technology in three of the sessions on offer
At Sensor+Test 2019, the CiS Research Institute will present current developments and research results from the MEMS, MOEMS and silicon detectors business units for applications in industry, medical and environmental technology
At HMI 2019, CiS will be presenting sophisticated packaging for time-of-flight camera modules, double-sided microstrip detectors and other current development results in a double pack at the Thuringia joint LEG stand in Hall 4, Stand F34 and at the stand of Forschungs- und Technologieverbund Thüringen e.V. (FTVT) in Hall 2, Booth A27
The SPIE Photonics West in San Francisco, the world’s largest event for photonic technologies, will start on Saturday with three conferences and two trade fairs
Our exhibition at the Innovation Day of SMEs of the BMWi on June 7, 2018 in Berlin generated good feedback and high interest. Here, our research institute presented the INNO-KOM project “Wafer Level Packaged Pressure Sensor With Through Silicon Vias”
For the 3rd time, the international workshop “Future of Silicon Detector Technologies” focused on technologies and devices for the development and production of radiation detectors. The focus was also on future research priorities in order to be able to manufacture sensors with extremely high radiation hardness with long-term stability and at low cost. In particular, the new experiments at CERN and at the Gesellschaft für Schwerionenforschung (Society for Heavy Ion Research) in Darmstadt require this radiation hardness in addition to other technical parameters
For the first time, CiS Forschungsinstitut für Mikrosensorik GmbH was represented as an exhibitor at SPIE Photonics West 2018 in San Francisco. As one of 70 German exhibitors in the German Pavilion in the North Hall of the Moscone Center, the CiS Research Institute demonstrated its expertise in the design as well as the manufacture and assembly of customised optical microsensors
Piezoresistive pressure sensor chips from CiS are used where high precision, stability and reliability are required. The same sensor principle is now also used for force measurement in silicon strain gages. The strain-sensitive resistors are monolithically integrated into wafer-thin chips as Wheatstone measuring bridge
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Germany
Tel.: +49 361 663 1410
E-Mail: info@cismst.de
