The aim of the recently launched SiCher research project is to develop industry-oriented functional models of SiC detectors for measuring high-energy radiation, in particular UV and X-ray photons as well as electrons. The focus of the development work is not only on the detectors themselves, but also on the assembly and connection technology
The newly launched Pack-Flu project deals with the design, realization and characterization of a robust and innovative packaging platform for low-cost MEMS-based microcalorimetric flow sensors for use in gas pipelines or ventilation systems. The platform serves as a scalable basis for flow sensors for analyzing and controlling air flow, hydrogen and other non-aggressive gases with known flow direction (e.g. in pipelines) with high accuracy
At the CiS Research Institute, pressure sensors based on NV centers in diamond were produced using industrial manufacturing methods in cooperation with partners from industry and science. The results of the Qind research project will be presented at the 28th Hasselt Diamond Workshop SBDD
On 9th November 2023, the CiS LABday will take place at the CiS Research Institute with a focus on “Piezoresistive Silicon Pressure Sensors”. Prof. Thomas Ortlepp and Dr. Klaus Ettrich will be the scientific directors. With practical content in the form of demonstrators, live demonstrations as well as vivid presentations, the CiS LABday conveys interesting facts about piezoresistive silicon pressure sensors
At the workshop “Current developments in hybrid and wafer-level assembly” on 12th September 2023 in Erfurt, experts from mechanical and plant engineering, semiconductor foundries, scientists and AVT experts discussed individual processes in packaging and interconnection technology, their technical status and future potential with a focus on silicon-based microsystems. All participants agreed: the workshop offered numerous, exciting contributions as well as opportunities for exchange, networking and idea generation
The CiS Workshop with focus on packaging and interconnect technology will take place on 12th September 2023 in Erfurt under the motto “Current developments in hybrid and wafer-level assembly”. Look forward to exciting contributions as well as ample opportunity for professional exchange and networking
In the SiDMeses research project, the long-term stability of hybrid silicon strain sensors was significantly improved by a targeted and accelerated reduction of the mechanical assembly stress and a precise, extremely parallel and symmetrical structure was generated
In the newly started project KoSenDi (Compact Sensor Unit for the Measurement of Magnetic Fields Using Diamond Fluorescence), scientists at the CiS Research Institute are working on the miniaturization of a magnetic field sensor based on sticksoff defects (NV centers) in diamond
The “Hivos” project follows the industry’s request and aims at higher automation by deposition and patterning of adhesive coatings at wafer level and the associated improved assembly accuracy. Innovative materials and processes are also intended to increase value creation at wafer/benefit level
Konrad-Zuse-Str. 14
99099 Erfurt
Germany
Tel.: +49 361 663 1410
E-Mail: info@cismst.de
