Piezoresistive pressure sensor chips from CiS are used where high precision, stability and reliability are required. The same sensor principle is now also used for force measurement in silicon strain gages. The strain-sensitive resistors are monolithically integrated into wafer-thin chips as Wheatstone measuring bridge
For the first time, CiS presented a new sensor for testing special bolt in safety-relevant applications at the joint stand of LEG Thüringen at the Hannover Messe 2017. Described as “Bolt 4.0”, the model impressed the trade visitors
At Sensor+Test 2017, the CiS Research Institute for Microsensors presents highly stable, media-resistant barometric pressure sensors in MEMS technology
Synthetic diamond coatings can be manufactured on an industrial scale to be CMOS-compatible. The manufacturing and processing costs are comparable to those of other technologies, such as passivation or contacting. In order to implement diamond coatings as passive as well as active functional layers in sensors and to evaluate their industrial applicability, the CiS Research Institute is dedicated to pressure measurement in aggressive working environments and intelligent thermal management in current R&D projects
At the CiS Research Institute, new types of silicon-based MEMS sensors are currently being developed to check safety-relevant bolt connections. Such special bolts are used, for example, in mechanical engineering, materials handling technology and wind turbines
For precision force measurements, the CiS Research Institute has developed miniaturised silicon strain gauges (Si-DMS) with an integrated measuring bridge. The piezoresistive resistors are monolithically integrated in single-crystal silicon (K-factor = 80) and are available as a double strain element and as a full bridge
Researchers and developers from both institutions are working together on a project to achieve greater reliability in the development and production of application-specific piezoresistive pressure sensors with a multi-physical simulation
CiS Forschungsinstitut für Mikrosensorik GmbH announces the signing of a distribution agreement with ESPEC Corp. on microcondensation sensors for the Japanese market. With this agreement, CiS grants the exclusive right to market and sell customised microcondensation sensors in Japan
The SMARTER-SI project offers a novel manufacturing platform across Europe on which innovative and intelligent sensor components and microsystems can be produced cost-effectively in small and medium quantities. Around 5.3 million euros in funding will flow into the development and testing of this platform until 2018
CiS has expanded its CCC® platform and for the first time offers microcondensation sensors with a calibrated digital output signal.
The aim is to effectively support customer-specific developments (condensate mass, temperature, design, assembly and connection technology)
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