Presentation at ACHEMA Pulse on 15.06.2021
In the virtual session “Safety First! Pt.1 at ACHEMA Pulse, Dr. Klaus Ettrich will present the topic: “Innovative sensors for monitoring mechanical connections” on 15.06.2021 at 14:20
In the virtual session “Safety First! Pt.1 at ACHEMA Pulse, Dr. Klaus Ettrich will present the topic: “Innovative sensors for monitoring mechanical connections” on 15.06.2021 at 14:20
For the measurement of clamping forces in safety-relevant bolted joints, the CiS Research Institute developed a sensitive washer including a measuring method for detecting and testing
Our second online webinar on the topic of “Silicon-based Piezoresistive Force Sensors” on 20.04.2021 was a complete success. The speakers Dr. Klaus Ettrich, Business Unit Manager MEMS, Dr. Thomas Frank, Department Manager MEMS, and André Grün, Development Engineer Packaging Technology, presented MEMS-based piezoresistive force sensors for monitoring preload forces or contact forces
Next week, the SENSOR+TEST 2021 trade fair and the accompanying international congress SMSI 2021 will start. Both events will take place online and the CiS Research Institute will be represented with a digital presence and a presentation. Get your free online ticket
This week at HM21 Digital Edition, we present current research topics and project results in the development of silicon-based MEMS and MOEMS sensor concepts
For the determination of surface hardness in the nanometer range, a new measuring head combining a force and displacement sensor is being developed in the recently launched “NanoSense” project. It is to be connected modularly to common universal testing machines and XY-axis manipulators
MEMS-based piezoresistive force sensors can be used to monitor preload forces or contact forces. Our webinar will go into the technical basics of such sensors and we will show you some demonstrators of silicon strain gauges (Si strain gauges) developed by us
At the 8th GMM Workshop Micro-Nano-Integration 2020 the CiS Research Institute will be represented with two exciting short lectures. The online conference is organized by the VDE/VDI Society for Microelectronics, Microsystems and Precision Engineering in cooperation with Ruhr-University Bochum
The CiS Research Institute uses its own piezoresistive, miniaturised silicon strain sensors (Si-DMS) with an integrated full bridge for hybrid force sensors. Glass solder bonding is used to join the Si strain gauges on the spring body at 90° to each other
Permanently safe flanged joints are the basic requirements for stable production processes and work at a high safety level. Recently developed silicon-based MEMS sensors are applied to bolt heads and measure their deformation due to changes in the preload force