CiS Research Institute leads the development of a micro-fluorescence sensor. In a multi-channel sensor the optical excitation with different light wavelengths and the measurement of transmission and fluorescence signals take place
Thuringia is significantly involved in the discovery of the Higgs elementary particle. Scientists and engineers of the CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH are working in Erfurt on radiation-hard silicon detectors for the international nuclear research elite at CERN (Geneva). The CiS Research Institute is proud to have contributed decisively to the success with its achievements and congratulates the colleagues in Switzerland
A miniaturized force sensor measures the forces at catheter tips that occur between the guide wire (catheter) and blood vessels during insertion. The KASYS mini-chip, just 200 x 220 x 640 µm in size and thus just twice as wide as a hair, is the heart of a haptic assistance system that will simplify catheterizations in medicine in the future and reduce the risk of injury
Technologies from microsystems engineering and microoptics form the basis for the successful miniaturization of a new, interferometric distance measurement system from TETRA GmbH in Ilmenau. The core component, consisting of a Michelsen laser interferometer and an optical silicon detector, was developed by the mechatronics specialist together with the Microoptical Systems Application Center at CiS Research Institute
Using MEMS wafer technologies and a silicon photodiode array with embedded laser light source (naked VCSEL), the CiS Research Institute has succeeded in integrating the complete optical sensing of the pressure-sensitive, membrane (Silizum) in a very flat package space – comparable to capacitive or piezoresistive sensors
The 3D structuring of silicon is becoming increasingly important for optical and opto-electronic applications in microsystems technology. For the reliable and low-loss coupling of optical fibers to photodiodes, the CiS Research Institute developed new microstructuring technologies for the fabrication of cavities with flank angles of 45° and 90° and high optical absorption of the sensitive coupling surface
For the use of sensor systems under extreme conditions, such as in EMC-critical or Ex-protected areas, a galvanic connection of the sensors for energy supply or signal transmission is often not possible. Together with industrial partners, the application center microoptical systems of the CiS research institute developed a solution compatible with existing fieldbus systems
Microstructured reactors have been successfully finding their way into the laboratories and production facilities of large-scale and fine chemistry as well as medicine for several years. Worldwide research activities impressively show that the use of the micro-process engineering components can achieve a multitude of reaction engineering advantages in chemical processes
Low-temperature silicon direct bonding has gained significantly in importance in recent years. In addition to the possibilities of vertical integration, it opens up new process technology opportunities through the application of wafer-level packaging as a post-process in sensor manufacturing
CiS has many years of expertise in the field of impedance sensor technology. In addition to the classic field of humidity measurement, new fields of application are being developed
