In the newly launched KHIS project, scientists at the CiS Research Institute are investigating a cost-effective package solution for small MEMS IR emitters. These packages shall offer a significant advantage in processability, usability and cost compared to conventional TO-sockets and shall be designed as SMD devices. At the same time, the package solution shall be applicable to different emitter sizes and have suitable thermal characteristics. Scalability and automated manufacturing will be considered from the beginning.
In the first phase of the project, various concepts will be investigated to explore different options, including silicon submounts and PCB packages based on selected PCB materials as well as packaging and interconnect technologies. The goal is to achieve a hermetically sealed package so that an inert gas (e.g. N2) can be enclosed within it.
This should make the emitter available for mass applications of gas sensors such as breath alcohol and breath gas tests.
The research and development work described is funded by the German Federal Ministry of Economic Affairs and Climate Action (BMWK) in the research project “Cost-efficient housing for IR emitters (KHIS)”.
Funding code: 49MF220218
