SPIE Photonics West 2022 in San Francisco, considered the world’s largest annual event for photonics, lasers and biomedical optics, kicks off the current exhibition year. We are very pleased to once again be personally present in San Francisco from January 25 to 27, 2022 as an exhibitor in the German Pavilion as part of the Photonics West Exhibition and to be able to present current development results.
Miniaturized infrared emitters offer significant advantages as a light source in optical gas sensors. They are capable of measuring different gas species, such as CO2, NOx, alcohol or ammonia. The CiS Research Institute develops and manufactures customer and application specific IR light sources for industrial, medical and consumer applications in close cooperation with CMOS IR GmbH and Micro-Hybrid Electronic GmbH from Hermsdorf.
Another highlight are 3D-structured photodiode arrays. By detecting the angle of incident light, these components enable a wide variety of applications such as sun tracking, climate and shading control, distance measurement and much more. CiS Research Institute has developed a tiny optical sensor that detects the angle of incident light with an accuracy of 2° across the entire half-space. The 1×1 mm² chip features a patterned 3D photodiode array that detects light from multiple directions.
Improved packages for UVC LEDs, whose light is a non-contact alternative to chemical disinfection, were developed using an optically matched potting material that directly reduces total internal reflection. In a joint project with JenCAPS Technology GmbH, the challenge of finding a UVC-stable, index-matched and easy-to-process material with a power yield of > 70% in light extraction was solved. The results of this project will be presented in the scientific paper in the accompanying congress.
We will show these and other technologies at our booth 4013-10.
Scientific paper:
25 January 2022 | 10:10 AM – 10:30 AM PST | Room 154 (Upper Mezzanine South)
Paper 12022-18
UVC LEDs: increase in optical performance through an optimized potting material
Presenter: Prof. Thomas Ortlepp
Authors: I. Käpplinger1, T. Schildhauer1, D. Mitrenga1, G. Leibeling2, M. Schädel1, T. Ortlepp1
1) CiS Forschungsinstitut für Mikrosensorik GmbH, Konrad-Zuse-Str. 14, 99099 Erfurt, Germany
2) JenCAPS Technology GmbH, Otto-Schott-Str. 15, 07745 Jena, Germany
